The competition is in PC market is so strong that the OEM (Original Equipment Manufacturer) or the total solution integrator tends to switch from one chip maker to another from time to time. Just recently, the OLPC (One Laptop Per Child) project announced that its Gen 1.5 will migrate to VIA Technologies’ platform solution, replacing existing solution using AMD Geode that has been used since … Continue reading OLPC Adopts VIA C7-M for Its Next Generation XO-1