Samsung Electronics, a global leader in semiconductor and telecommunication has developed a 4GB multi-chip package (MCP) targeted at 3G mobile phones market. This innovation has eliminated the need to implement external memory card slot and software development for NAND memory that significantly simplifies the design and time-to-market for the mobile phone manufacturers. The new MCP integrates a 4GB embedded memory, which consists of 1Gb mobile … Continue reading Samsung Unveils 4GB Multi-Chip Package (MCP) for 3G Mobile Market