VIA Technologies has just unveiled a new COM (Computer-on-module) that is based on new Mobile-ITX form factor. Claimed to be the smallest COM form factor in the industry, the platform with codenamed of Via Epia-T700 is mainly targeted for embedded applications such as healthcare, in-vehicle infotainment and even military usages. Measured at only 6cm x 6cm, the COM will be powered by Via C7-M ULV … Continue reading VIA Epia-T700 Mobile-ITX Smallest COM Targeted for Embedded Market